Celebrating Two Decades of Deep Cultivation and Embracing the Dragon Boat Festival: A Letter from [GHT] to All Partners and Customers Dear Partners and Customers: The air is filled with the fragrance of mugwort, and dragon boats race across the water. On the occasion of the Dragon Boat Festival in the Year of the Horse, all colleagues at [GHT] extend our sincerest holiday greetings to you! As a company with over twenty years of experience in electronic product manufacturing, we have deeply cultivated the three core areas of memory, SSDs, and motherboards, resonating with the industry and witnessing and participating in every technological revolution and market ups and downs. I. Market Trends: Storage "Dragon Boat" Race, Motherboard "Road" Under Pressure Looking back at the first half of 2026, the global storage and PC hardware market is experiencing an unprecedented "dragon boat race"—AI computing power demand is driving the entire industry chain forward at full speed, bringing about dramatic structural changes. Memory (DRAM): Prices remain at historically high levels. Based on September 2025, by mid-June 2026, the average price increase for DDR5 memory had reached 288%, with mainstream 32GB kits priced nearly four times the benchmark level. The DDR5 price index in the German market rebounded rapidly to 419% after a brief dip in March. Analysts predict that the average selling price of DRAM will still have room for a 30% increase in the third quarter of 2026. The pressure from AI on production capacity has not been fundamentally alleviated, and the price increase may continue into 2027. Solid State Drives (SSDs): Prices are also high. The average price of a 1TB NVMe SSD has increased by 112% compared to the benchmark. For example, a 1TB model from a certain brand cost approximately €50 in September 2025, but now costs nearly €140. More noteworthy is the dramatic change in market structure—the consumer retail SSD market has essentially shrunk, and controller chip and NAND production capacity is shifting on a large scale to OEM system supply. Motherboards: As the "backbone" of complete system assembly, the motherboard market is experiencing pressure from upstream suppliers. High prices for memory, SSDs, and graphics cards have significantly dampened consumer willingness to build new PCs. Industry data shows that in April 2026, motherboard shipments in mainland China decreased by approximately 9% month-on-month and a sharp 44% year-on-year decline, marking the largest monthly drop in recent years. Leading motherboard manufacturers are projected to see shipments plummet to 5 million units in the first half of 2026, and hover around 10 million units for the entire year, a decrease of one-third compared to the 15 million units shipped in 2025. The four major motherboard manufacturers will experience an average decline of approximately 28%. Gartner predicts that global PC shipments will decline by 10.4% in 2026 due to rising memory costs. II. Two Decade...

Celebrating Two Decades of Deep Cultivation and Embracing the Dragon Boat Festival: A Letter from [GHT] to All Partners and Customers Dear Partners and Customers: The air is filled with the fragrance of mugwort, and dragon boats race across the water. On the occasion of the Dragon Boat Festival in the Year of the Horse, all colleagues at [GHT] extend our sincerest holiday greetings to you! As a company with over twenty years of experience in electronic product manufacturing, we have deeply cultivated the three core areas of memory, SSDs, and motherboards, resonating with the industry and witnessing and participating in every technological revolution and market ups and downs. I. Market Trends: Storage "Dragon Boat" Race, Motherboard "Road" Under Pressure Looking back at the first half of 2026, the global storage and PC hardware market is experiencing an unprecedented "dragon boat race"—AI computing power demand is driving the entire industry chain forward at full speed, bringing about dramatic structural changes. Memory (DRAM): Prices remain at historically high levels. Based on September 2025, by mid-June 2026, the average price increase for DDR5 memory had reached 288%, with mainstream 32GB kits priced nearly four times the benchmark level. The DDR5 price index in the German market rebounded rapidly to 419% after a brief dip in March. Analysts predict that the average selling price of DRAM will still have room for a 30% increase in the third quarter of 2026. The pressure from AI on production capacity has not been fundamentally alleviated, and the price increase may continue into 2027. Solid State Drives (SSDs): Prices are also high. The average price of a 1TB NVMe SSD has increased by 112% compared to the benchmark. For example, a 1TB model from a certain brand cost approximately €50 in September 2025, but now costs nearly €140. More noteworthy is the dramatic change in market structure—the consumer retail SSD market has essentially shrunk, and controller chip and NAND production capacity is shifting on a large scale to OEM system supply. Motherboards: As the "backbone" of complete system assembly, the motherboard market is experiencing pressure from upstream suppliers. High prices for memory, SSDs, and graphics cards have significantly dampened consumer willingness to build new PCs. Industry data shows that in April 2026, motherboard shipments in mainland China decreased by approximately 9% month-on-month and a sharp 44% year-on-year decline, marking the largest monthly drop in recent years. Leading motherboard manufacturers are projected to see shipments plummet to 5 million units in the first half of 2026, and hover around 10 million units for the entire year, a decrease of one-third compared to the 15 million units shipped in 2025. The four major motherboard manufacturers will experience an average decline of approximately 28%. Gartner predicts that global PC shipments will decline by 10.4% in 2026 due to rising memory costs. II. Two Decade...

Global AI Expansion Triggers Historic Surge in Memory and SSD Markets Driven by the relentless expansion of global AI infrastructure, the DRAM and SSD industries are entering an unprecedented "super cycle." With tech giants and Cloud Service Providers (CSPs) aggressively hoarding supply, severe capacity shortages have sent contract and spot prices into a vertical spike.   1. Market Status (Mid-2026): Storage as "Liquid Gold" · Skyrocketing Forecasts: Goldman Sachs has revised its 2026 price growth forecasts upwards to 250%–280% for DRAM and 200%–250% for NAND flash (the core component of SSDs). · Q2 Surge: TrendForce data shows that in Q2 2026, conventional DRAM contract prices surged 58% - 63% quarter-on-quarter. NAND Flash contract prices jumped another 70% - 75% on top of doubling in the previous quarter. · Mid-Year Peak: Analysts note that average selling prices (ASP) for chips hit their first major cyclical peak around June 2026. Consumer SSD spot prices are currently hovering at historic highs with stubborn resistance to drops. · Downstream Price Hikes: Surging component costs have squeezed device makers. Hardware giants like Lenovo have finalized comprehensive price hikes across their entire PC and hardware lineups starting July 2026.     2. Key Technical Trends: Capacity and Interface Breakouts Memory (DRAM): Accelerated DDR5 Transition · HBM Domination: High-Bandwidth Memory (HBM) remains the undisputed core for AI GPU clusters, locking in its dominant position for the next 2-3 years. · The End of DDR4: Original manufacturers are aggressively shifting production lines to HBM, shrinking DDR4 supplies. This deficit is forcing mainstream platforms to accelerate their migration to high-bandwidth, low-power DDR5. · CXL Gains Traction: Compute Express Link (CXL) technology is emerging as the premier post-HBM solution, leveraging memory pooling to bypass physical hardware scaling limits. Solid-State Drives (SSD): Breaking the 245TB Barrier · Density Over 200 Terabytes: To feed data-hungry AI models, Micron launched a 122TB enterprise SSD built on its 9th-gen (G9) 3D NAND, while teasing an upcoming 245TB single-drive model that rewrites industry records. · The Dawn of PCIe 6.0: The world's first enterprise PCIe 6.0 SSD (Micron 9650) has debuted, delivering double the sequential performance of existing flagship drives to completely break data-loading bottlenecks

Storage Market Gains Attention, While SSD and Memory Prices Face Short-Term Pressure   SSD Market: Inventory Reduction Remains the Main Focus The SSD market showed a mild downward trend this week. Compared with previous years, promotional activity during the shopping season has been less aggressive. However, some brands continue to offer competitive pricing to stimulate sales and support channel partners. At present, many distributors are prioritizing inventory clearance, leading to price adjustments across several product categories. Price movements this week: l NVMe PCIe 3.0 SSDs: Most capacities declined by approximately 2%-8%, while 240GB and 2TB remained stable. l NVMe PCIe 4.0 SSDs: Most capacities declined by around 2%, except for 480GB, which remained unchanged. l SATA SSDs: Smaller capacities remained stable, while larger capacities fell by approximately 1%-3%. Overall, the SSD market is still focused on inventory optimization and improving cash flow. DRAM Market: Stable Pricing with Improved Trading Activity DRAM prices remained largely stable this week, while market trading activity showed noticeable improvement. However, the overall supply-demand balance in the DDR4 market remains largely unchanged. Current market observations include: l High-capacity DDR4 products continue to face some pricing pressure. l DDR5 demand remains relatively stable and continues to outperform DDR4. l The DRAM market is expected to remain generally stable in the short term. In the OEM memory market this week: l DDR4 pricing remained stable across most capacities, with only 16GB 2666MHz modules declining by around 1%. l DDR3 4GB modules increased by approximately 3%, while 8GB modules remained unchanged. Market Outlook Although the market is currently in a traditional seasonal slowdown, industry sentiment toward future demand recovery remains positive. In the near term, SSD suppliers are expected to continue focusing on inventory management, while the DRAM market is likely to maintain stable pricing and healthy inventory levels.    

Yangtze Memory Technologies Co., Ltd. (YMTC) saw its revenue surge by 445% year-on-year in the first quarter.   The global NAND flash memory market is experiencing an unprecedented boom, and Yangtze Memory Technologies (YMTC) is reaping the biggest benefits. According to a recent Counterpoint report, the global NAND flash memory market size in the first quarter of this year increased 3.5 times year-on-year, reaching $46 billion. This surge is driven by the massive deployment of AI infrastructure. Servers need to store weights and training data, and the NAND usage per AI server is several times that of a regular server. YMTC's revenue in the first quarter surged 445% year-on-year, and its global NAND flash memory market share rose to 13%.   1. Phase I production capacity is nearing its limit.   2. Phase II achieved full production capacity in just two years.   3. Phase III wafer fab construction will begin in Wuhan in the second half of this year.   4. New production lines are producing next-generation high-stack-number flash memory products. At the current pace of expansion, total output this year is expected to surpass SK Hynix and Micron, with its overall scale second only to Samsung and Kioxia.   Over the past six months, driven by the demand for AI computing power, Samsung, SK Hynix, and Micron have all shifted their production capacity towards high-margin HBM and enterprise-grade SSDs, continuously compressing consumer-grade flash memory capacity. As a result, storage chip prices for mobile phones and PCs have risen steadily, with some DDR5 and enterprise-grade NAND contract prices increasing by over 50% in a single quarter. The supply side is limited; AI applications are prioritized, followed by enterprise-grade applications, naturally leaving limited space for consumer-grade devices.   For users planning to upgrade their SSDs or integrate with new platforms, storage prices are unlikely to ease in the short term. However, from another perspective, Yangtze Memory Technologies Co., Ltd. (YMTC) is one of the few players in the domestic supply chain capable of "reverse-increase" production during a price-increase cycle.

How is the ram memory trend in second half of year? Did Samsung strike really affect the Chinese market?   Hello, friends. Welcome to Temo Blog. This is Winnie.  The most significant market disruption in recent times stems from the strike by the Samsung Electronics labor union. On evening of 20th. May,The Samsung Electronics labor union has announced the suspension of the 18-day general strike originally scheduled to begin on May 21, and will instead hold a vote on a preliminary wage agreement between May 22 and May 27. Market sentiment was notably boosted by progress in labor negotiations at Samsung Electronics; during intraday trading, Samsung Electronics shares surged over 6%, while SK Hynix also rose by approximately 8%. At the same time, affected by this news, ram memory in China market also price raise in recent two weeks. As matters currently stand, the impact of this event on the market appears to be primarily psychological rather than affecting actual supply. In the short term, expectations of a strike at Samsung, production controls by original manufacturers, and inventory stocking ahead of the peak season will continue to underpin market prices. However, from a medium-to-long-term perspective, the strength of the recovery in end-market demand, the pace of production expansion by domestic manufacturers, and whether AI-driven demand can be consistently realized will ultimately determine the duration and price ceiling of the next memory cycle. But in terms of products, we think prices for both DDR4 and DDR5 continue to rise. Overall, while the pace of price increases may slow in the second half of the year, a strong market cycle is expected to persist through 2026 and 2027.   Best regards,   Winnie        

AI Computing Power "Eats" Memory: DRAM Prices Soar Over 60%, Domestic Chips Break Through Against the Trend May 18, 2026 A "supercycle" driven by artificial intelligence (AI) is propelling the global memory industry to unprecedented heights. In the second quarter of 2026, contract prices for mainstream memory products generally surged by 60% to 70%, with some server and mobile memory chips even recording quarterly increases exceeding 150%. While Samsung, SK Hynix, and Micron are shifting over 80% of their production capacity to high-profit AI-specific memory, downstream mobile phone and PC industries are experiencing an unprecedented cost storm. Meanwhile, Changxin Memory, a leading domestic memory manufacturer, delivered an "explosive" performance, successfully becoming the fourth largest player in the global DRAM market. According to the latest data released by TrendForce, in the second quarter of 2026, DRAM (Dynamic Random Access Memory) contract prices surged by 58%-63% quarter-on-quarter, while NAND Flash (flash memory) prices rose even more dramatically by 70%-75%. This marks the second consecutive quarter of significantly higher-than-expected price jumps. The price increases for specific product categories are even more astonishing. 64GB DDR5 memory for AI servers saw a 150% increase in a single quarter, 12GB LPDDR5X memory rose by 130%, and some high-specification products even reached 300%. Meanwhile, traditional LPDDR4X contract prices also surged by 70%-75%. Analysts point out that the current price increases and speed of memory have exceeded the industry peak of 2017-2018, a phenomenon rarely seen in the past decade. “The fundamental reason is simple: AI is consuming all available capacity,” said an analyst at ICwise Research. Samsung, SK Hynix, and Micron collectively control over 90% of the global memory market. In pursuit of the ultra-high profit margins of HBM (High Bandwidth Memory) and enterprise-grade SSDs, they have shifted over 80% of their new and adjustable capacity to these AI-related products. The HBM capacity gap remains as high as 50%-60%, severely squeezing general-purpose DRAM capacity. One HBM chip consumes the equivalent of 3-4 standard DDR5 chips, and this supply-side distortion is transmitted throughout the entire market. The price surge in memory costs is being borne by end consumers and system integrators. Driven by AI, the arms race among the three major memory manufacturers has intensified. Samsung plans to extend its HBM technology to mobile devices, increasing bandwidth in phones and tablets by 30%, and will provide samples of its next-generation CXL 3.1 memory modules to customers in the third quarter. Simultaneously, Samsung has officially discontinued its LPDDR4/4X product line, focusing entirely on the high-profit AI sector. SK Hynix, leveraging its deep partnership with Nvidia, sold nearly $5.2 billion worth of products to Nvidia in the first quarter, a 62.6% year-on-year increase. The company's market ...

Memory and SSD: 2026 Latest Developments ‌一、Memory Technology: HBM Dominates the AI Era, DDR6 Enters Sampling Phase‌ · High Bandwidth Memory (HBM) Emerges as the Core of AI Computing Power‌： SK Hynix has globally debuted HBM4 (featuring a 12-layer stack with a single-stack capacity of up to 48GB) and has entered the mass production phase. While HBM3E is set to become the mainstream standard in 2025, HBM4 is expected to see accelerated adoption across NVIDIA, AMD, and domestic AI chips in 2026. Thanks to its bandwidth exceeding 1TB/s and low power consumption, HBM has emerged as the sole choice for training large-scale AI models, accounting for over 70% of global DRAM production capacity.。 · Consumer Memory: DDR5 Achieves Widespread Adoption： DDR5-8000 has emerged as the absolute mainstream standard in the global consumer market, with DDR5-8000 products from Samsung, SK Hynix, and Micron now fully rolled out. · DDR6 Enters Preliminary R&D Phase: JEDEC has yet to release the final DDR6 standard, as disagreements persist regarding key parameters—specifically voltage, pin layout, and sub-channel architecture. Although Samsung and SK Hynix have already initiated sample validation, deployment in 2028 is expected to be limited exclusively to server platforms; consumer-grade motherboards (such as AMD AM6 and Intel LGA1851) are unlikely to offer support until 2030. · Production capacity and supply remain tight.‌： In Q2 2026, global contract prices for general-purpose DRAM are projected to rise by 58%–63% quarter-on-quarter, primarily because AI servers are prioritizing and absorbing production capacity for HBM and high-density DDR5. Micron has completely exited the consumer-grade DRAM business; the global consumer market is now dominated by Samsung (38%), SK Hynix (25%), and CXMT (18%), with Chinese brands collectively holding a global market share of less than 20%. ‌二、SSD Technology: PCIe Gen6 + CXL Reshapes Storage Architecture‌ · ‌PCIe Gen6 SSD Commercial Launch‌： InnoGrit and Pengtai Storage are set to launch the world's first PCIe Gen6 AI SSDs in Q1 2026, featuring sequential read speeds of up to 28 GB/s, 512B random read performance exceeding 50M IOPS, and latency as low as 2.8 μs—specifically optimized for AI inference KV caching.。 · ‌The CXL Protocol Emerges as a Key Interface‌： Enterprise-grade SSDs have begun to support CXL 3.0, enabling pooled memory sharing with CPUs and GPUs and breaking through traditional NVMe bottlenecks. NVIDIA’s BlueField-4 platform has integrated SSDs into the GPU’s context caching hierarchy, thereby transforming the SSD from a mere "storage device" into an "AI data scheduling node." · ‌QLC and PLC NAND: Enterprise-Dominant, Consumer-Constrained‌： Enterprise-grade QLC SSDs have surpassed the 200TB capacity mark per drive, serving the AI "warm data" tier; meanwhile, PLC NAND has not yet achieved large-scale commercial adoption due to limitations in lifespan and cost, leaving TL...